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ASE Weighs Further Capex Hike to Meet AI Packaging Demand

With a record $8.5 billion capital expenditure budget already locked in for 2026, ASE Technology Holding is signaling that even more spending may be required. COO Tien Wu suggests that the world’s largest chip-packaging provider is preparing to build over a dozen new sites to satisfy long-term AI hardware requirements.

ASE Weighs Further Capex Hike to Meet AI Packaging Demand

The planned expansion, spanning roughly 15 new locations, focuses on capacity needs through 2030 rather than immediate market cycles. Wu noted that lessons learned from post-pandemic surges, combined with the rapid acceleration of artificial intelligence, necessitate a preemptive approach to infrastructure. This strategy positions ASE to maintain its critical role as a chokepoint in the global supply chain, specifically for high-performance chip packaging.

Technological advancement remains central to this growth. ASE is preparing to launch the industry's first fully automated, economically viable FO-PLP production line before the end of the year, a move designed to increase processing density. While Washington continues to pressure the industry to localize chip operations, ASE is balancing geopolitical considerations with its own competitive requirements. The company is currently evaluating potential facility investments in California and Arizona to complement its growing hub in Penang, Malaysia. Having seen annual spending climb from $2 billion to an projected $8.5 billion this year, management remains prepared to commit additional capital as AI demand expands into physical robotics and next-generation electronics.

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