The Endura chip relies on a radiation-hardened 45nm silicon-on-insulator platform, manufactured at the GlobalFoundries facility in Malta, New York. This strategic approach allows the company to blend high-performance commercial manufacturing with the specialized design methods required for space-grade electronics. According to Joe Dziezynski, the product line director for BAE Systems Space Systems, the architecture provides a smaller, lower-power, and cost-effective alternative to traditional, bulkier space processors.

Beyond simple processing, the Endura line integrates general-purpose capabilities, secure boot, and FPGA components. These elements enable hardware-accelerated input and output, which BAE Systems claims will deliver exponential improvements in speed and overall power efficiency for next-generation satellite systems. The company is currently accepting orders for software development units, with assembly and testing conducted at their Manassas, Virginia site—a facility certified as a Category 1A Microelectronics Trusted Source by the U.S. government.