The company will issue 3.96 billion yuan in zero-coupon convertible bonds due in 2027. These instruments carry an initial conversion price of HK$128.82, marking a 13% premium over Wednesday's closing price. Simultaneously, the firm is placing 18.4 million H shares at HK$105.16 each, a price point reflecting an 8% discount to recent market valuations.

Management plans to allocate the $832.6 million in net proceeds toward expanding photonics production capacity in China, Malaysia, Mexico, and the United States. Beyond physical infrastructure, the firm intends to acquire stakes in upstream enterprises and bolster general working capital. Market reaction was split following the disclosure: Hong Kong-listed shares climbed 3.15%, while the company's Shanghai-listed equity dipped 0.4%. In a separate move, Shanghai Biren Technology also announced a HK$4.02 billion capital raise through a share placement to fund its own research and development efforts.