The project will unfold in two distinct phases, with initial construction and equipment installation slated for completion by late 2028. Subsequent production scaling will remain contingent on shifting market demand. By establishing this hub, JCET aims to bolster its high-end packaging capacity, a move that aligns with China’s broader push for semiconductor self-sufficiency in the face of restrictive U.S. export controls.

Advanced packaging has emerged as a critical workaround for domestic firms struggling to manufacture cutting-edge silicon. By stacking and binding mature nodes into high-performance systems, the technology offers a path toward processing power that bypasses the need for extreme-ultraviolet lithography. Citi analysts noted the investment positions the company to capture significant volume from the domestic AI chip ramp-up. With first-quarter profits already climbing 40% to 290 million yuan, JCET continues to leverage its global footprint—spanning China, South Korea, and Singapore—to supply major tech entities like Apple while pivoting toward the lucrative demands of AI and high-speed data storage.